Liquid crystal device, manufacturing method therefor, and electronic apparatus

ABSTRACT

The liquid crystal display device has a structure having substrates  200  and  300  adhered to each other by a sealing material  110  with a predetermined gap therebetween and having liquid crystal  160  enclosed in the gap. On an opposing surface of the substrate  200,  transparent electrodes  214  are formed, and on an opposing surface of the substrate  300,  segment electrodes  314  are formed. The common electrodes  214  are connected to wiring  350  formed on the substrate  300  via conductive particles  114  mixed in the sealing material  110,  and the wiring  350  are each a laminated film of a transparent conductive film  354  composed of the same conductive layer as that of the segment electrode  314  and a low-resistance conductive film  352  composed of a low-resistance material, such as chromium, having a resistance lower than that of the transparent conductive film  354.  However, the low-resistance conductive film  352  is formed at an area other than the portion connecting with the conductive particles  114.

CROSS REFERENCE TO RELATED APPLICATIONS

[0001] This application is a divisional patent application of U.S. Ser.No. 09/865,186 filed May 24, 2001, claiming priority to JapaneseApplication No. 2001-103495 filed Apr. 2, 2001, Japanese Application No.2000-154696 filed May 25, 2000 and Japanese Application No. 2000-154695filed May 25, 2000, all of which are hereby incorporated by reference.

BACKGROUND OF THE INVENTION

[0002] 1. Technical Field of the Invention

[0003] The present invention relates to liquid crystal devices whichreduce wiring resistance, to manufacturing methods therefor, and toelectronic apparatuses using the liquid crystal devices for displayportions.

[0004] 2. Description of the Related Art

[0005] As has been well known, since liquid crystal display devices haveadvantages in weight and electric power consumption compared to displaydevices using CRTs (cathode ray tubes), in particular, they are widelyused for display portions of electronic apparatuses which are requiredto have portability.

[0006] Liquid crystal display devices generally have a structure inwhich two substrates are bonded to each other with a predetermined gaptherebetween so that electrode forming surfaces thereof oppose eachother, and liquid crystal is received in the gap; and when roughlyclassified in accordance with a driving mode, they can be classifiedinto an active matrix type in which liquid crystal is driven byswitching elements, and a passive matrix type in which liquid crystal isdriven without using switching elements. In addition, the former, theactive matrix type, can be further classified into a type which usesthree-terminal elements, such as a thin-film transistor (TFT), asswitching elements, and a type which uses two-terminal elements such asa thin-film diode (TFD).

[0007] The type which uses TFD elements as the switching elements amongactive matrix types and the simple passive matrix type have a structurein which scanning lines (common electrodes) are formed on one substrateand data lines (segment electrodes) are formed on the other substrate.Accordingly, in these types described above, since scanning signals(common signals) and data signals (segment signals) must be supplied bybonding an FPC substrate to each of the two substrates, problems ofcomplicated bonding step and an increase in cost may arise. Accordingly,in the types described above, a technique has been proposed to bond onepiece of FPC substrate to only one of the two substrates by using astructure in which all wirings or electrodes formed on the othersubstrate are connected to wirings formed on said one of the twosubstrates via conducting materials, that is, a structure is formed sothat all wirings or electrodes formed on the other substrate aregathered on said one of the two substrates.

[0008] However, in the technique described above, the wirings formed onsaid one of the two substrates are composed of the same material as thatused for transparent electrodes on said one of the two substrates, whichapply a voltage to the liquid crystal. In this connection, as a materialused for the transparent electrode mentioned above, ITO (Indium TinOxide) is generally used; however, the square resistivity of thistransparent electrode material is high compared to that of a commonmetal. Accordingly, when the transparent electrode material describedabove is used for wirings for electrical connection in an area otherthan the display area, the resistance is naturally increased, and as aresult, a problem may arise in that the image quality is adverselyinfluenced.

[0009] In particular, recently, in order to reduce the number ofconnection points between a liquid crystal panel and a FPC substrate,driver ICs for driving the scanning lines (common electrodes) and thedata lines (segment electrodes) are mounted on a glass substrate of theliquid crystal panel in some cases. In the case described above, variouscontrol signals and clock signals must be supplied to the driver ICs;however, when the transparent electrode material described above is usedfor wiring from the FPC substrate to the driver ICs, since the timeconstant is increased concomitant with an increase in wiring resistance,deformation of waveforms, a decrease in amplitude, and the like occur,and as a result, a problem may arise in that the operation margin isnarrowed.

[0010] The present invention was made in view of the problems describedabove, and an object of the present invention is to provide a liquidcrystal device which reduces resistance of wirings formed on asubstrate, a manufacturing method therefor, and an electronic apparatususing the liquid crystal device for the display portion.

SUMMARY OF THE INVENTION

[0011] Accordingly, a liquid crystal device of one aspect of the presentinvention is a liquid crystal device having a first substrate and asecond substrate, which are disposed to oppose each other, and liquidcrystal enclosed in a gap between the first substrate and the secondsubstrate, which comprises: a first transparent electrode provided onthe first substrate; a first wiring provided on the second substrate;and a conductive material connecting the first transparent electrode andthe first wiring; wherein the first wiring comprises a metal oxide filmand a conductive film having a resistance lower than that of the metaloxide film. According to the structure described above, since the firstwiring is a laminated film composed of a chemically stable metal oxidefilm and a chemically unstable conductive film having a resistance lowerthan that of the metal oxide film, compared a single layer composed ofone of the two films described above, a lower resistance and improvedstabilization of the wiring can be obtained.

[0012] In the structure described above, the conductive material iscomposed of nonconductive particles formed of, for example, a plasticcovered with a metal such as gold (Au), and a metal oxide film generallyhas better adhesion with this covering metal. As a result, in thestructure described above, the conductive film of the first wiring ispreferably formed on an area other than the portion connecting with theconductive material.

[0013] In addition, preferably, the structure described above furthercomprises a driver IC provided on the second substrate for driving theliquid crystal, wherein the driver IC comprises an output side bump forsupplying a signal, the output side bump is connected to the firstwiring, and the conductive film is formed on an area other than theportion connecting with the driver IC. When the driver IC for drivingthe liquid crystal is mounted on the second substrate via the firstwiring, the conductive material, and the first transparent electrode asdescribed above, the number of connection points with the external canalso be decreased. Furthermore, when the driver IC is bonded to thewiring, an adhesive having conductive particles dispersed therein isused, and similar to the conductive material described above, theconductive particles are formed of nonconductive particles such as aplastic covered with a metal such as gold (Au). Accordingly, when theconductive film is formed on an area other than the portion connectingwith the driver IC, the metal oxide film and the covering metalcontained in the conductive material are brought into contact with eachother, and as a result, the adhesion therebetween is improved.

[0014] Furthermore, preferably, the structure described above furthercomprises a second wiring which is provided on the second substrate andwhich comprises a metal oxide film and a conductive film having aresistance lower than that of the metal oxide film; and a driver ICprovided on the second substrate for driving the liquid crystal; whereinthe driver IC comprises an input side bump for inputting a signal, theinput side bump is connected to the second wiring, and the conductivefilm included in the second wiring is formed on an area other than theportion connecting with the driver IC. As a result, since the secondwiring is a laminated film formed of a chemically stable metal oxidefilm and a chemically unstable conductive film having a resistance lowerthan that of the metal oxide film, compared to a single layer composedof one of the two films described above, a lower resistance of thewiring can be obtained. Accordingly, since the signals are supplied tothe driver IC driving the liquid crystal via the second wiring having alower resistance, the influence caused by voltage drop and the like canbe suppressed to be small. In addition, when the metal oxide film isprovided at the portion connecting with the driver IC without using thelow-resistance conductive film, the adhesion with the covering metalcontained in the conductive material can also be improved.

[0015] The liquid crystal device having the second wiring and the ICdriver preferably further comprises a first protruding area which isprovided in the vicinity of one edge of the second substrate and whichdoes not overlap with the first substrate; and a second protruding areawhich is provided in the vicinity of another edge, intersecting said oneedge, of the second substrate and which does not overlap with the firstsubstrate; wherein the driver IC is provided on the first protrudingarea, and the second wiring is provided on the first protruding area andon the second protruding area.

[0016] In addition, structure described above preferably furthercomprises an external circuit substrate connected to the second wiringon the second protruding area; wherein the conductive film included inthe second wiring is formed on an area other than the portion connectingwith the external circuit substrate. Accordingly, signals can besupplied to the IC driver from the external circuit substrate via thesecond wiring having a lower resistance.

[0017] In addition, in the structure described above, it is alsopreferable that the liquid crystal device further comprise a secondtransparent electrode provided on the second substrate and a driver ICconnected to the second transparent electrode. Accordingly, a signal canbe supplied to the second transparent electrode by the driver IC.

[0018] In addition, the liquid crystal having the second transparentelectrode and the IC driver, which are provided on the second substrate,preferably further comprises a second wiring which is provided on thesecond substrate and which comprises a metal oxide film and a conductivefilm having a resistance lower than that of the metal oxide film; afirst protruding area which is provided in the vicinity of one edge ofthe second substrate and which does not overlap with the firstsubstrate; and a second protruding area which is provided in thevicinity of another edge, intersecting said one edge, of the secondsubstrate; wherein the driver IC is provided on the first protrudingarea and comprises an input side bump for inputting a signal from thesecond wiring, and the second wiring is provided on the first protrudingarea and on the second protruding area. In the structure describedabove, since the second wiring is a laminated film formed of achemically stable metal oxide film and a chemically unstable conductivefilm having a resistance lower than that of the metal oxide film,compared to a single layer composed of one of the two films, a lowerresistance and improved stabilization of the wiring can be obtained. Asa result, since signals are supplied to the driver IC via the secondwiring having a lower resistance, the influence of voltage drop and thelike can be suppressed to be small.

[0019] In addition, in the structure described above, the conductivefilm included in the second wiring is preferably formed on an area otherthan the portion connecting with the driver IC. At the portionconnecting with the driver IC, when the metal oxide film is providedwithout using the low-resistance conductive film, the adhesion of themetal oxide film with the covering metal contained in the conductivematerial can also be improved.

[0020] Accordingly, since an electronic apparatus according to anotheraspect of the present invention comprises the liquid crystal devicedescribed above, the wiring resistance is decreased, and as a result,adverse influence to the display quality and reduction in operationmargin of the driving circuit can be prevented.

[0021] In addition, a liquid crystal device in accordance with anotheraspect of the present invention is a liquid crystal device having afirst substrate and a second substrate, which are disposed to opposeeach other, and liquid crystal enclosed in a gap between the firstsubstrate and the second substrate, which comprises: a first transparentelectrode provided on the first substrate; a first wiring provided onthe second substrate; a conductive material connecting the firsttransparent electrode and the first wiring; a second transparentelectrode provided on the second substrate; and a second wiring which isprovided on the second substrate and which is connected to the secondtransparent electrode; wherein at least one of the first and the secondwirings comprises a metal oxide film and a conductive film having aresistance lower than that of the metal oxide film. According to thestructure described above, since the first and the second wirings aregathered on the second substrate, the connection with the external canbe easily performed. In addition, since at least one of the first andthe second wirings is a laminated film formed of a chemically stablemetal oxide film and a chemically unstable conductive film having aresistance lower than that of the metal oxide film, compared to a singlelayer composed of one of the two films, a lower resistance and improvedstabilization of the wiring can be obtained.

[0022] In the structure described above, the liquid crystal devicepreferably further comprises a driver IC provided on the secondsubstrate for driving the liquid crystal; wherein the driver ICcomprises an output side bump for supplying a signal, and the outputside bump is connected to the first or the second wiring. As describedabove, when the driver IC connected to the first or the second wiring ismounted on the second substrate, the number of connection points withthe external can be reduced.

[0023] In addition, in the structure described above, the liquid crystaldevice preferably further comprises an external circuit substratesupplying signals to each of the first and the second wirings.Accordingly, since signals are supplied from the external circuitsubstrate to the first and the second wirings, it is not necessary tomount an IC driver on the second substrate.

[0024] In addition, a liquid crystal device in accordance with anotheraspect of the present invention is a liquid crystal device having afirst substrate and a second substrate, which are disposed to opposeeach other, and liquid crystal enclosed in a gap between the firstsubstrate and the second substrate, which comprises: a first protrudingarea which is provided in the vicinity of one edge of the secondsubstrate and which does not overlap with the first substrate; a secondprotruding area which is provided in the vicinity of another edge,intersecting said one edge, of the second substrate and which does notoverlap with the first substrate; and a wiring which is provided on thefirst protruding area and on the second protruding area; wherein thewiring comprises a metal oxide film and a conductive film having aresistance lower than that of the metal oxide film. According to thestructure described above, since the wiring is a laminated film formedof a chemically stable metal oxide film and a conductive film having aresistance lower than that of the metal oxide film, even when the wiringis provided on the first and the second protruding portions, a lowerresistance of the wiring can be obtained.

[0025] Furthermore, a liquid crystal device in accordance with anotheraspect of the present invention is a liquid crystal device having afirst substrate and a second substrate, which are disposed to opposeeach other, and liquid crystal enclosed in a gap between the firstsubstrate and the second substrate, which comprises: a plurality offirst transparent electrodes provided on the first substrate; aconductive shading film which is provided between the first transparentelectrodes adjacent to each other and which is not in electrical contactwith the first transparent electrodes; and wirings which are provided onthe first substrate and which are connected to the transparentelectrodes; wherein the wirings comprise substantially the same layer asthat of the first transparent electrodes and substantially the samelayer as that of the shading film. In the structure described above,since the layer used as the shading film on the first substrate is alsoused as the conductive layer having a lower resistance of the laminatedwiring, without adding a specific step, a lower resistance of the wiringcan be obtained.

[0026] In addition, a liquid crystal device in accordance with anotheraspect of the present invention is a liquid crystal device having afirst substrate and a second substrate, which are disposed to opposeeach other, and liquid crystal enclosed in a gap between the firstsubstrate and the second substrate, which comprises: a plurality offirst transparent electrodes provided on the first substrate; aconductive shading film which is provided between the first transparentelectrodes adjacent to each other and which is not in electrical contactwith the first transparent electrodes; a wiring provided on the firstsubstrate; a second transparent electrode provided on the secondsubstrate; and a conductive material connecting the wiring and thesecond transparent electrode; wherein the wiring comprises substantiallythe same layer as that of the first transparent electrodes andsubstantially the same layer as that of the shading film. In thestructure described above, since the layer used as the shading film onthe first substrate is also used as the conductive layer having a lowerresistance of the laminated wiring, without adding a specific step, alower resistance of the wiring can be obtained. In addition, the secondtransparent electrode provided on the second substrate is connected tothe wiring provided on the first substrate by the conductive material.As a result, the connection with the external can be achieved only byconnecting the first substrate therewith.

[0027] In addition, a method for manufacturing a liquid crystal device,in accordance with another aspect of the present invention, is a methodfor manufacturing a liquid crystal device having a first substrate and asecond substrate, which are disposed to oppose each other, and liquidcrystal enclosed in a gap between the first substrate and the secondsubstrate, which comprises: a step of providing a first transparentelectrode on the first substrate; a step of providing a first wiring onthe second substrate; and a step of connecting the first transparentelectrode and the first wiring by a conductive material; wherein thefirst wiring comprises a metal oxide film and a conductive film having aresistance lower than that of the metal oxide film. According to themethod described above, since the first wiring is a laminated filmformed of a chemically stable metal oxide film and a conductive filmhaving a resistance lower than that thereof, compared to a single layercomposed of one of the two films described above, a lower resistance ofthe wiring can be obtained.

[0028] Furthermore, a method for manufacturing a liquid crystal device,in accordance with another aspect of the present invention, is a methodfor manufacturing a liquid crystal device having a first substrate and asecond substrate, which are disposed to oppose each other, and liquidcrystal enclosed in a gap between the first substrate and the secondsubstrate, which comprises: a step of providing a plurality of firsttransparent electrodes on the first substrate; a step of providing aconductive shading film between the first transparent electrodesadjacent to each other so as not to be in electrical contact with thefirst transparent electrodes; and a step of providing wirings connectedto the first transparent electrodes on the first substrate; wherein thewirings are formed so as to comprise substantially the same layer asthat of the first transparent electrodes and substantially the samelayer as that of the shading layer. In the method described above, sincethe layer used as the shading film on the first substrate is also usedas a conductive layer having a low resistance of the laminated wiring,without adding a specific step, a lower wiring resistance can beobtained.

[0029] In addition, a method for manufacturing a liquid crystal device,in accordance with another aspect of the present invention, is a methodfor manufacturing a liquid crystal device having a first substrate and asecond substrate, which are disposed to oppose each other, and liquidcrystal enclosed in a gap between the first substrate and the secondsubstrate, which comprises: a step of providing a plurality of firsttransparent electrodes on the first substrate; a step of providing aconductive shading film between the first transparent electrodesadjacent to each other so as not to be in electrical contact with thefirst transparent electrodes; and a step of connecting a wiring providedon the first substrate and a second transparent electrode provided onthe second substrate by a conductive material; wherein the wiring isformed so as to comprise substantially the same layer as that of thefirst transparent electrode and substantially the same layer as that ofthe shading layer. In the method described above, since the layer usedas the shading film on the first substrate is also used as a conductivelayer having a low resistance of the laminated wiring, without adding aspecific step, a lower resistance of the wiring can be obtained, and inaddition, the connection with the external can be achieved only byconnecting the first substrate therewith.

BRIEF DESCRIPTION OF THE DRAWINGS

[0030]FIG. 1 is a perspective view showing an entire structure of aliquid crystal panel forming a liquid crystal display device accordingto the First Embodiment of the present invention.

[0031]FIG. 2 is a partial cross-sectional view showing the structure ofthe liquid crystal panel taken along the X direction.

[0032]FIG. 3 is a plan view showing the structure of pixels in theliquid crystal panel and the structure in the vicinity of a sealingmaterial.

[0033]FIG. 4 is a cross-sectional view taken along the line A-A′ in FIG.3.

[0034]FIG. 5 includes (a) and (b) which are partial cross-sectionalviews each showing the vicinity of mounting areas of driver ICs of theliquid crystal panel.

[0035]FIG. 6 is a partial plan view showing the vicinity of a mountingarea of a driver IC on a substrate at the back surface side of theliquid crystal panel.

[0036]FIG. 7 includes views showing a manufacturing process of asubstrate at an observer side of the liquid crystal panel.

[0037]FIG. 8 includes views showing a manufacturing process of thesubstrate at the back surface side of the liquid crystal panel.

[0038]FIG. 9 includes views showing a manufacturing process of thesubstrate at the back surface side of the liquid crystal panel.

[0039]FIG. 10 is a perspective view showing a modified embodiment of theliquid crystal panel.

[0040]FIG. 11 is a perspective view showing another modified embodimentof the liquid crystal panel.

[0041]FIG. 12 is a partial cross-sectional view showing still anothermodified embodiment of the liquid crystal panel.

[0042]FIG. 13 is a partial enlarged view showing a substrate at anobserver side according to an application of the liquid crystal panel.

[0043]FIG. 14 is a perspective view showing an entire structure of aliquid crystal panel forming a liquid crystal display device accordingto the Second Embodiment of the present invention.

[0044]FIG. 15 is a partial cross-sectional view showing the structure ofthe liquid crystal panel taken along the X direction.

[0045]FIG. 16 is a partial cross-sectional view showing the structure ofthe liquid crystal panel taken along the Y direction.

[0046]FIG. 17 is a plan view showing the structure of pixels in theliquid crystal panel and the structure in the vicinity of a sealingmaterial.

[0047]FIG. 18 is a partial cross-sectional view showing the vicinity ofa mounting area of a driver IC of the liquid crystal panel.

[0048]FIG. 19 includes views showing a manufacturing process of asubstrate at the back surface side of the liquid crystal panel.

[0049]FIG. 20 includes views showing a manufacturing process of asubstrate at the back surface side of the liquid crystal panel.

[0050]FIG. 21 includes views showing a manufacturing process of asubstrate at the back surface side of the liquid crystal panel.

[0051]FIG. 22 is a perspective view showing a modified embodiment of theliquid crystal panel.

[0052]FIG. 23 is a perspective view showing another modified embodimentof the liquid crystal panel.

[0053]FIG. 24 is a perspective view showing the structure of a personalcomputer using a liquid crystal panel of an embodiment as an example ofan electronic apparatus.

[0054]FIG. 25 is a perspective view showing the structure of a mobilephone using a liquid crystal panel of an embodiment as an example of anelectronic apparatus.

[0055]FIG. 26 is a perspective view showing the structure of the backsurface side of a digital still camera using a liquid crystal panel ofan embodiment as an example of an electronic apparatus.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0056] Hereinafter, the embodiments of the present invention will bedescribed with reference to drawings.

[0057] First, a liquid crystal display device according to FirstEmbodiment of the present invention will be described. This liquidcrystal display device is a transflective type which serves as areflective display when outside light is sufficient and which serves asa transmissive display by turning on a backlight when outside light isinsufficient.

[0058]FIG. 1 is a perspective view showing the structure of a liquidcrystal panel of the liquid crystal display device. In this figure, inorder to facilitate understanding of the structure of the liquid crystalpanel, the back surface side thereof with respect to an observer isshown on the front side in the figure. In addition, FIG. 2 is apartially cross-sectional view showing the structure of the liquidcrystal panel taken along the X direction in the case in which theobserver side is the upper side. Accordingly, it must be kept in mindthat the top and the bottom in FIGS. 1 and 2 are opposite to each other.

[0059] As shown in these figures, a liquid crystal panel 100 has astructure in which a substrate 300 located at the observer side isbonded to a substrate 200, which is located at the back surface side andwhich is one size smaller than the substrate 300 at the observer side,with a predetermined gap therebetween formed by a sealing material 110containing conductive particles 114, which are also used as spacers,mixed therein, and in which, for example, TN (Twisted Nematic) typeliquid crystal 160 is enclosed in the gap. In this structure, thesealing material 110 is formed on one of the substrates along the insideperiphery of the substrate 200, and an opening is provided in a part ofthe sealing material in order to inject the liquid crystal 160 into thegap. Accordingly, after the liquid crystal is enclosed, the openingportion is encapsulated by an encapsulating material 112.

[0060] Next, on an opposing surface of the substrate (a first substrate)200 at the back surface side, which opposes the substrate 300 at theobserver side, a plurality of common (scanning) electrodes 214 is formedextending in the X (line) direction, and in addition, on an opposingsurface of the substrate 300 at the observer side, which opposes thesubstrate 200 at the back surface side, a plurality of segment (data)electrodes 314 is formed extending in the Y (column) direction.Accordingly, in this embodiment, at the areas at which the commonelectrodes 214 and the segment electrodes 314 cross each other, since avoltage is applied to the liquid crystal 160 by the two electrodes, thecrossing areas serve as sub-pixels.

[0061] In addition, on areas in the vicinities of the two edges of theopposing surface of the substrate (the second substrate) 300 at theobserver side, which protrude from the substrate 200 at the back surfaceside, as described below, a driver (driving circuit) IC 122 for drivingthe common electrodes 214 and a driver IC 124 for driving the segmentelectrodes 314 are mounted, respectively, by a COG (Chip On Glass)technique. Furthermore, to an area outside the driver IC 124 mounted onthe area in the vicinity of one of the two edges described above, a FPCsubstrate (Flexible Printed Circuit) substrate 150 is bonded.

[0062] The common electrodes 214 formed on the substrate 200 areconnected to ends of wirings (first wirings) 350 formed on the substrate300 at the observer side via the conductive particles 114 mixed in thesealing material 110. In addition, the other ends of the wirings 350 areconnected to output side bumps of the driver IC 122. That is, the driverIC 122 mounted on the substrate 300 is formed to supply common signalsto the common electrodes 214 formed on the substrate 200 at the backsurface side via the wirings 350, the conductive particles 114, and thecommon electrodes 214. In this structure, input side bumps of the driverIC 122 and the FPC substrate 150 are connected with each other bywirings (second wirings) 360.

[0063] The segment electrodes 314 formed on the substrate 300 at theobserver side extend to the outside of the sealing frame and areconnected to output side bumps of the driver IC 124. That is, the driverIC 124 mounted on the substrate 300 is formed to directly supply segmentsignals to the segment electrodes 314 formed on the same substrate 300.

[0064] In addition, input side bumps of the driver IC 124 and the FPCsubstrate 150 are connected with each other by wirings (second wirings)370. That is, the FPC substrate 150 is formed to supply various signalsincluding a power source to the driver IC 122 via the wirings 360 and tothe driver IC 124 via the wirings 370.

[0065] In this connection, in the liquid crystal panel 100, as shown inFIG. 2, a polarizer 131 and a retardation film 133 are practicallyprovided on the substrate 300 at the observer side, and in addition, apolarizer 121 and a retardation film 123 are practically provided on thesubstrate 200 at the back surface side (opposite side to the observerside); however, they are not shown in FIG. 1. In addition, for thesubstrate 200 at the back surface side, a backlight is provided so thatthe transmissive type is used when outside light is insufficient;however, this is not shown in FIGS. 1 and 2.

[0066] Next, details of a display area of the liquid crystal panel 100will be described. First, the substrate 300 at the observer side will bedescribed in detail. As shown in FIG. 2, to the external surface of thesubstrate 300, the retardation film 133 and the polarizer 131 areadhered. In addition, on the interior surface of the substrate 300, aplurality of strip-shaped segment electrodes 314 is formed extending inthe Y direction (the direction perpendicular to the paper in thefigure).

[0067] Furthermore, on the surfaces of the segment electrodes 314, analignment film 308 composed of a polyimide or the like is formed. Inthis connection, the alignment film 308 is processed by a rubbingtreatment in a predetermined direction before adhering to the substrate200 at the back surface side. Since the alignment film 308 is notnecessary outside the display area, this film is not provided in thevicinity of the sealing material 110 and in the outside thereof.

[0068] Subsequently, the substrate 200 at the back surface side will bedescribed. To the exterior surface of the substrate 200, the retardationfilm 123 and the polarizer 121 are adhered. In addition, on the interiorsurface of the substrate 200, a scattering resinous layer 203 havingirregularity formed thereon is formed. As described below, thescattering resinous layer 203 is formed by, for example, performingheating treatment on a photoresist having a dot pattern so as to softenthe edge portions of the photoresist.

[0069] Next, on the irregular surface of the scattering resinous layer203, a reflecting film 204 composed of a reflective metal, such asaluminum or silver, is formed. Accordingly, in conformity with theirregularity of the scattering resinous layer 203, the surface of thereflecting film 204 has irregularity, and hence, when light incidentfrom the observer side is reflected at the reflecting film 204, thelight is appropriately diffused.

[0070] In this embodiment, since the liquid crystal panel serves as atransmissive type, in the reflecting film 204, for example, two openingportions 209 in each sub-pixel for allowing light from the backlight topass therethrough are provided (refer to FIG. 3). In this connection,without providing opening portions 209 described above, for example, byforming a film composed of a metal having light reflectivity, such asaluminum, so as to be relatively thin (20 nm to 50 nm), a structure maybe formed in which a part of the incident light from the back surfaceside is allowed to pass therethrough.

[0071] Furthermore, on the surface of the reflecting film 204,corresponding to the areas at which the common electrodes 214 and thesegment electrodes 314 cross each other, red color filters 205R, greencolor filters 205G, and blue color filters 205B are provided in apredetermined alignment. In this embodiment, the red color filters 205R,the green color filters 205G, and the blue color filters 205B arealigned in a stripe matrix (refer to FIG. 3) suitable for data-baseddisplay, and three sub-pixels, i.e., R (red), G (green), and B (blue),form one pixel in the form of an approximately regular tetragon;however, the present invention is not limited thereto.

[0072] Next, on the surfaces of the color filters 205R, 205G, and 205B,a planarizing film 207 composed of an insulating material is formed,whereby steps of the color filters and the irregularity of thereflecting film 204 and the like are planarized. In addition, on theflat surface of the planarization film 207 thus formed, a plurality ofstrip-shaped common electrodes 214 composed of a transparent conductivematerial, such as ITO, is formed extending in the X direction (the leftto right direction in FIG. 2).

[0073] On the surfaces of the common electrodes 214, alignment film 208composed of a polyimide or the like is formed. For the alignment film208, a rubbing treatment is performed in a predetermined directionbefore the substrate at the back surface side is adhered to thesubstrate 300 at the observer side. In addition, since the individualcolor filters 205R, 205G, and 205B, the planarizing film 207, and thealignment film 208 are not necessary in area other than the displayarea, they are not provided in the vicinity of the sealing material 110and the outside thereof.

[0074] Next, in the liquid crystal panel 100, the vicinity of the areaat which the sealing material 110 will be described with reference toFIGS. 3 and 4 in addition to FIG. 2. FIG. 3 is a plan view of a detailedwiring structure in the vicinity of that area when viewed from theobserver side to the back surface side, and FIG. 4 is a cross-sectionalview taken along the line A-A′.

[0075] First, as shown in FIGS. 2 and 3, the common electrodes 214 onthe substrate 200 at the back surface side are formed so as to extend tothe area at which the sealing material 110 is formed, and transparentelectrode films 354, which form the wirings 350, on the substrate 300 atthe observer side are formed extending to the area at which the sealingmaterial 110 is formed so as to oppose the common electrodes 214.Accordingly, when the conductive particles 114, which are also used asspacers, are dispersed in the sealing material 110 in an appropriateratio, the common electrodes 214 and the transparent electrode films 354are electrically connected to each other via the conductive particles114.

[0076] As described above, the wirings 350 connect between the commonelectrodes 214 and the output side bumps of the driver IC 122 on theopposing surface of the substrate 300 at the observer side and moreparticularly, are each formed of a laminate of a low-resistanceconductive film 352 and the transparent conductive film 354. In thelaminate, the low-resistance conductive film 352 is a conductive layercomposed of a low-resistance material (for example, chromium) having aresistance lower than that of the transparent conductive film 354, andthe transparent conductive film 354 is composed of the same conductivelayer as that of the segment electrode 314. Both the low-resistanceconductive film 352 and the transparent conductive film 354 have beenpatterned so as to have an approximately equivalent shape to each otheras shown in FIG. 4. However, on the area at which the sealing material110 is formed, as shown in FIGS. 2 and 3, the low-resistance conductivefilm 352 is not formed, but the transparent conductive film 354 is onlyprovided. That is, the low-resistance conductive film 352 is formed onan area other than the portion connecting with the conductive particles114 contained in the sealing material 110.

[0077] In this connection, the diameter of the conductive particle 114shown in FIG. 2 is larger than the actual size for ease illustration inthe figure, and hence, even though it seems that one particle isprovided in the width direction of the sealing material 110; however,practically, as shown in FIG. 3, a plurality of conductive particles 114is disposed in the width direction of the sealing material 110.

[0078] Subsequently, the areas on which the driver ICs 122 and 124 aremounted and the vicinity of the area to which the FPC substrate 150 isbonded on the substrate 300 at the observer side will be described. FIG.5(a) is a cross-sectional view showing the vicinity of the area aboutthe wiring, to which the driver IC 122 and the FPC substrate 150 arebonded, FIG. 5(b) is a cross-sectional view showing the vicinity of thearea about the wiring, to which the driver IC 124 is bonded. Inaddition, FIG. 6 is a plan view showing a wiring structure in themounting area of the driver IC 122 when viewed from the back surfaceside through the observer side, that is, a plan view of the mountingarea of the driver IC when viewed from above.

[0079] As described above, on the substrate 300 at the observer side, inaddition to the segment electrodes 314, the wirings 350, 360, and 370are provided; however, in this case, the wirings 350 and 360 connectedto the driver IC 122 will be described by way of example.

[0080] First, the wirings 350 for supplying common signals from thedriver IC 122 to the common electrodes 214 are each a laminated filmcomposed of the low-resistance conductive film 352 and the transparentconductive film 354; however, as shown in FIG. 6, on the area on whichthe driver IC 122 is mounted, the low-resistance conductive film 352 isnot provided, and the transparent electrode 354 is only formed. In otherwords, the low-resistance conductive film 352 is formed on an area otherthan the portion connecting with the driver IC 122.

[0081] The wirings 360 for supplying various signals supplied from theFPC substrate 150 to the driver IC 122, similar to the wirings 350, areeach a laminated film composed of a low-resistance conductive film 362and a transparent conductive film 364. Between these two films, thelow-resistance conductive film 362 is composed of the same conductivelayer as that of the low-resistance conductive film 352 of the wiring350, and in addition, the transparent conductive film 364 is composed ofthe same conductive layer as that of the segment electrode 314 and thetransparent conductive film 354. The low-resistance conductive film 362and the transparent conductive film 364 are patterned so as to have theshapes approximately equivalent to each other as shown in parentheses inFIG. 4. However, in the wirings 360, on the area on which the driver IC122 is to be mounted and on the area to which the FPC substrate 150 isto be bonded, as shown in FIGS. 5(a) and 6, the low-resistanceconductive film 362 is not provided, and the transparent conductive film364 is only formed. In other words, the low-resistance conductive film362 is formed on area other than the portions connecting with the driverIC 122 and the FPC substrate 150.

[0082] On these wirings 350 and 360, the driver IC 122 is mounted by,for example, COG described below. First, a plurality of electrodes isprovided on the periphery portion of one surface of the driver IC 122 inthe rectangular parallelepiped, and bumps 129 a and 129 b composed of,for example, gold (Au) are formed for individual electrodes beforehand.Next, after the top to bottom relationship shown in FIG. 5 is reversed,first, an anisotropic conductive film in the form of a sheet, which iscomposed of an adhesive 130 such as an epoxy resin and conductiveparticles 134 uniformly dispersed therein, is placed on the area onwhich the driver IC 122 is to be mounted of the substrate 300 at theobserver side; secondary, the driver IC 122 having an electrode formingsurface at the bottom side thereof and the substrate 300 hold theanisotropic conductive film therebetween; and, thirdly, after aligning,the driver IC 122 is pressed and heated on the substrate 300 via theanisotropic conductive film provided therebetween.

[0083] As a result, the output side bumps 129 a of the driver IC 122 forsupplying common signals and the input side bumps 129 b thereof forinputting signals from the FPC substrate 150 are electrically connectedto the transparent electrode films 354 forming the wirings 350 and thetransparent electrode films 364 forming the wirings 360, respectively,with the conductive particles 134 in the adhesive 130 therebetween. Inthe case described above, the adhesive 130 also serves as an sealingmaterial protecting the electrode forming surface of the driver IC 122from moisture, stains, stresses, and the like.

[0084] Heretofore, the wirings 350 and 360 connected to the driver IC122 are described by way of example, and in addition, the wirings 370for supplying various signals supplied from the FPC substrate 150 to thedriver IC 124 have the same arrangement as that for the wirings 360, asshown in parentheses in FIG. 4 and FIG. 5(b). That is, similar to thewirings 360, the wirings 370 are each a laminated film composed of alow-resistance conductive film 372 and a transparent conductive film374, the low-resistance conductive film 372 is composed of the sameconductive layer as that of the low-resistance conductive films 352 and362 of the wirings 350 and 360, and the transparent conductive film 374is composed of the same conductive layer as that of the segmentelectrode 314 and the transparent conductive films 354 and 364. Inaddition, the low-resistance conductive film 372 and the transparentconductive film 374 are patterned so as to have the shapes approximatelyequivalent to each other, as shown in parentheses in FIG. 4. However, inthe wirings 370, on the area on which the driver IC 124 is to be mountedand on the area to which the FPC substrate 150 is to be bonded, as shownin parentheses in FIG. 5(a) and FIG. 5(b), the low-resistance conductivefilm 372 is not provided, and the transparent conductive film 374 isonly formed. In other words, the low-resistance conductive film 372 isformed on area other than the portions connecting with the driver IC 124and the FPC substrate 150.

[0085] Next, similar to the driver IC 122, the driver IC 124 isconnected to the segment electrodes 314 and the wirings 370 via ananisotropic conductive film. In addition, when the FPC substrate 150 isconnected to the wirings 360 and 370, similarly to that described above,an anisotropic conductive film is used. As a result, in the FPCsubstrate 150, the wirings 154 formed on the substrate 152 composed of apolyimide or the like are electrically connected to the transparentconductive films 364 forming the wirings 360 and the transparentconductive films 374 forming the wirings 370 by conductive particles 144in an adhesive 140.

[0086] Next, the manufacturing process for the liquid crystal displaydevice described above will be described. First, the manufacturingprocess for the substrate 300 at the observer side will be describedwith reference to FIG. 7. In this description, the inside of the sealingframe (display area) and the sealing material will be described,respectively, mainly on the segment electrodes 314 and the wirings 350.In addition, for ease of illustration, the top to bottom relationshipshown in FIG. 7 is opposite to those shown in FIGS. 2 and 5.

[0087] First, as shown in FIG. 7(a), on the entire interior surface ofthe substrate 300, metal (for example, chromium) having a resistancelower than that of a metal oxide having transparency, such as ITO, isdeposited by sputtering or the like, thereby forming a low-resistancemetal layer 352′. Next, as shown in the same figure (b), thelow-resistance metal layer 352′ is patterned by a photolithographictechnique and an etching technique, whereby, in addition to thelow-resistance conductive films 352 forming the wirings 350, thelow-resistance conductive films 362 and 372 forming the wirings 360 and370, respectively, are formed.

[0088] Next, as shown in the same figure (c), a transparent conductivelayer 314′ composed of ITO or the like is formed by using sputtering oran ion plating method. Subsequently, as shown in the same figure (d),the transparent conductive layer 314′ is patterned by aphotolithographic technique or an etching technique, whereby the segmentelectrodes 314 and the transparent conductive films 354 of the wirings350 are formed. In the step described above, the transparent conductivefilms 362 and 372 forming the wirings 360 and 370 are simultaneouslyformed by patterning.

[0089] Next, after coating or printing is performed by, for example,using a polyimide solution, as shown in the same figure (e), thealignment film 308 is formed by firing. Subsequently, a rubbingtreatment is performed on the alignment film 308.

[0090] Next, a manufacturing process of the substrate 200 at the backsurface side will be described with reference to FIGS. 8 and 9.

[0091] First, as shown in FIG. 8(a), on the entire interior surface ofthe substrate 200, a negative photoresist is applied and baked, therebyforming a resinous layer 203″. Next, the resinous layer 203″ is exposedby using a photomask which allows a plurality of light rays to locallypass therethrough and is then developed. As a result, as shown in thesame figure (b), inside the sealing frame, areas (exposed areas) exposedby the light are removed, thereby forming a plurality of projections 203a. In this connection, by using a positive photoresist, the projections203 a may be formed by curing areas exposed by light and by removingareas which are not exposed by the light.

[0092] Next, as shown in the same figure (c), the substrate 200 havingthe projections 203 a formed thereon is processed by a heating treatmentat a temperature of a heat distortion temperature of the photoresist ormore. By this heating treatment, the projections 203 a are softened,whereby the corner portions thereof become round. As a result, ascattering resinous layer 203 is formed having relatively smoothirregularity. In this connection, in accordance with the scatteringcharacteristics required for the scattering resinous layer 203, amaterial (viscosity, film thickness, and the like) for the resinouslayer 203″, the shape of the projection 203 a, and intervalstherebetween are determined.

[0093] Furthermore, as shown in the same figure (d), a reflecting layer204′ composed of a silver alloy or aluminum is formed by sputtering orthe like. Next, as shown in the same figure (e), the reflecting layer204′ is patterned by a photolithographic technique and an etchingtechnique, thereby forming the reflecting films 204. When the patterningis performed, the opening portions 209 are simultaneously formed.

[0094] Subsequently, a resinous layer colored by one of R (red), G(green), and B (blue) is formed and is then patterned by aphotolithographic technique and an etching technique, thereby formingcolor filters displaying one color. The color filters for the other twocolors are formed by patterning in a manner similar to that describedabove. As a result, as shown in FIG. 9(f), on the reflecting films 204having the opening portions 209 therein, the color filters 205R, 205G,and 205B are formed corresponding to the individual colors, R, G, and B,respectively.

[0095] Next, as shown in the same figure (g), a resinous material suchas an acrylic resin is coated or printed and is then baked, therebyforming the planarizing film (overcoat) 207. The planarizing film 207 isformed so as to cover the color filters 205R, 205G, and 205B, and thereflecting films 204, and is formed so as not to extend to the area atwhich the sealing material 110 is to be formed.

[0096] Subsequently, on the entire interior surface of the substrate 200provided with the planarizing film 207 formed thereon, a transparentconductive layer composed of ITO or the like is formed by sputtering, anion plating method, or the like and is then patterned by aphotolithographic technique and an etching technique, thereby formingthe common electrodes 214 (refer to the same figure (h)).

[0097] Next, after coating and printing is performed by, for example,using a polyimide solution, as shown in the same figure (i), thealignment film 208 is formed by firing. Subsequently, a rubbingtreatment is performed on the alignment film 208.

[0098] Even though the manufacturing process which is subsequentlyperformed is not shown in the figure, the substrate 200 at the backsurface side having the alignment film 208 processed by a rubbingtreatment and the substrate 300 at the observer side having thealignment film 308 processed by a rubbing treatment are bonded togetherby the sealing material 110 containing the conductive particles 114appropriately dispersed therein, and after the laminate thus formed isplaced in a state approximately a vacuum, the liquid crystal 160 isdripped in the opening portion of the sealing material 110. Next, byreturning the pressure to normal pressure, the liquid crystal 160 isinfiltrated inside the sealing frame, and the opening portion is thenencapsulated by the encapsulating material 112. Subsequently, asdescribed above, by mounting the driver ICs 122 and 124, and the FPCsubstrate 150, the liquid crystal panel 100 as shown in FIG. 1 isformed.

[0099] Next, display operation for the liquid crystal display devicehaving the structure described above will be briefly described. First,the driver IC 122 applies a selected voltage in a predetermined order toeach common electrode 214 in each horizontal scanning period, and thedriver IC 124 supplies each segment signal via corresponding segmentelectrode 314 in accordance with a display content of one line ofsub-pixels located along the common electrode 214 to which the selectedvoltage is applied. In this step, in accordance with the differencebetween the voltages applied to the common electrode 214 and the segmentelectrode 314, the orientation state of the liquid crystal 160 at eachsub-pixel in the area is controlled.

[0100] In FIG. 2, when outside light from the observer side istransmitted through the polarizer 131 and the retardation film 133, theoutside light is in a predetermined polarized state, and in addition,via a path from the substrate 300 at the observer side→the segmentelectrode 314→the liquid crystal 160→the common electrode 214→the colorfilter 205, the outside light reaches the reflecting film 204, isreflected thereat, and retraces the path through which it passed.Accordingly, in the reflective type, since the orientation state of theliquid crystal 160 varies in accordance with the difference between thevoltages applied to the common electrode 214 and the segment electrode314, the amount of the outside light finally viewed by the observer,which is reflected at the reflecting film 204 and is then transmittedthrough the polarizer 131, is controlled for each sub-pixel.

[0101] In contrast, in the case in which a backlight (not shown) locatedat the back surface side of the substrate 200 is turned on, whentransmitted through the polarizer 121 and the retardation film 123, thelight is placed in a predetermined polarized state, and in addition, isemitted to the observer side via a path from the substrate 200 at theback surface side→the opening portions 209→the color filter 205→thecommon electrode 214→the liquid crystal 160→the segment electrode314→the substrate 300 at the observer side→the polarizer 131.Accordingly, also in the transmissive type, since the orientation stateof the liquid crystal 160 varies in accordance with the differencebetween the voltages applied to the common electrode 214 and the segmentelectrode 314, the amount of the light finally viewed by the observer,which is transmitted through the opening portions 209 and is thentransmitted through the polarizer 131, is controlled for each sub-pixel.

[0102] As described above, according to the liquid crystal displaydevice of this embodiment, since the reflective type is used whenoutside light is sufficient, and when outside light is insufficient, thetransmissive type is used by turning on the backlight, both typedisplays can be performed.

[0103] Since the wirings 350, 360, and 370 have laminated structure ofthe transparent conductive films 354, 364, and 374, and low-resistanceconductive films 352, 362, and 372 composed of conductive layers havinga lower resistance than that mentioned above, respectively, compared toa single transparent conductive film or a single low-resistanceconductive film, a lower resistance can be obtained. In particular,since the wirings 360 from the FPC substrate 150 to the input side bumpsof the driver IC 122 includes a power source line of the driver IC 122supplying common signals, a relatively high voltage is applied thereto,and in addition, the wiring distance thereof is longer compared to thatof the wirings 370. As a result, when the wirings 360 have a highresistance, the influence by the voltage drop cannot be ignored. Incontrast, since the wirings 360 of this embodiment are formed so as tohave a low resistance, the influence by voltage drop can be reduced.

[0104] In addition, in this embodiment, the common electrodes 214provided on the substrate 200 at the back surface side are connected tothe output side of the driver IC 122 mounted on the substrate 300 at theobserver side via the conductive particles 114 and the wirings 350.Accordingly, in this embodiment, even though it is a passive matrixtype, bonding with the FPC substrate 150 can be performed at oneposition on one surface. As a result, an easier mounting step can berealized.

[0105] In addition, in the areas on which the sealing material 110 isformed and on which the driver IC 122 is mounted, the low-resistanceconductive films 352 of the wirings 350 are not provided, and thetransparent conductive films 354 are only provided. Furthermore, in theareas on which the driver IC 122 is mounted and to which the FPCsubstrate 150 is bonded, the low-resistance conductive films 362 of thewirings 360 are not provided, and the transparent conductive films 364are only provided. In a manner similar to that described above, in theareas on which the driver IC 124 is mounted and to which the FPCsubstrate 150 is bonded, the low-resistance conductive films 372 of thewirings 370 are not provided, and the transparent conductive films 374are only provided.

[0106] The reason for this is that the conductive particles 114 mixed inthe sealing material 110, and the conductive particles 134 and 144dispersed in the adhesives 130 and 140, respectively, are formed ofnonconductive particles such as a plastic covered with a metal such asgold (Au), and better adhesion of the covering metal with thetransparent conductive film can be obtained compared to that with thelow-resistance conductive film and can also be obtained when nolow-resistance conductive film is present under the transparentconductive film. That is, when wiring resistance is preferentiallyreduced, a structure which is formed by laminating the transparentconductive film and the low-resistance conductive film is preferable;however, in the structure mentioned above, the probability of occurrenceof connection defects becomes higher in a bonding step of thesubstrates, a mounting step of the driver IC, and a bonding step of theFPC substrate. Accordingly, in this embodiment, at a portion to whichthe conductive particles are connected, the low-resistance conductivefilm is not provided, and the transparent conductive film is onlyprovided.

[0107] In addition, in view of simplified structure, it may beconsidered that the reflecting film itself is also used as an electrode;however, the structure mentioned above is not employed in thisembodiment by the reason described below. That is, since the electrodesformed on the substrate at the observer side are required to havetransparency, a transparent electrode material such as ITO is used, andwhen the other electrodes are formed of a reflective metal which is alsoused as the reflecting film, the deflection of the polarity occurs whenthe liquid crystal is held between two different metals. Accordingly, inthis embodiment, the reflecting layer is not used as the commonelectrode, and the common electrodes 214 are formed by patterning atransparent conductive material, such as ITO, which is also used for thesegment electrodes 314.

[0108] In the First Embodiment described above, the structure isdescribed in which the common electrodes 214 and the segment electrodes314 are driven by the driver IC 122 and the driver IC 124, respectively;however, the present invention is not limited thereto and, for example,can be applied to a type having a one-chip driver IC formed by combiningthe two driver ICs as shown in FIG. 10.

[0109] In the liquid crystal display device shown in the figure, aplurality of common electrodes 214 extending in the X direction formedon the substrate 200 at the back surface side is the same as thatdescribed in the First Embodiment; however, a structure in which commonelectrodes 214 in the upper half extending to one side and commonelectrodes 214 in the bottom half extending to the other side of thesubstrate are connected to a driver IC 126 is a different point fromthat described in the First Embodiment. In this structure, the driver IC126 is a one-chip driver IC formed by combining the driver ICs 122 and124 in the First Embodiment, and as a result, segment electrodes 314 arealso connected thereto. An FPC substrate 150 supplies various signalsfrom an external circuit (not shown) via wirings 360 (370) forcontrolling the driver IC 126. In this connection, in the liquid crystaldisplay device shown in FIG. 10, when the number of the commonelectrodes 214 is not enough, a structure may be formed in which thecommon electrodes 214 extend only to the one side.

[0110] In addition, as shown in FIG. 11, the present invention can beapplied to a type having a liquid crystal panel 100 which mounts nodriver IC thereon. That is, in the liquid crystal display panel shown inthe figure, a driver IC 126 is mounted on an FPC substrate 150 by a flipchip technique or the like. Furthermore, by using a TAB (Tape AutomatedBonding) technique, a structure may be formed in which bonding isperformed by using inner leads of the driver IC 126, and bonding thereofto the liquid crystal panel 100 is performed by using outer leads.However, in the structure described above, as the number of pixels isincreased, the number of connection points with the FPC substrate 150 isincreased.

[0111] In addition, in the First Embodiment, the transparent 354, 364,and 374 are laminated with the low-resistance conductive films 352, 362,and 372 as the lower layers thereof, respectively; however, the presentinvention is not limited thereto, and as shown in FIG. 12, a structuremay be formed in which a transparent conductive film 354 used as a lowerlayer and a low-resistance conductive layer 352 are laminated with eachother. In the structure described above, a lower wiring resistance canalso be obtained.

[0112] In addition, in the First Embodiment, a passive matrix type whichdrives liquid crystal without using switching elements is described;however, a structure may be formed which is driven by TFD (Thin FilmTransistor) elements each provided in a sub-pixel (or a pixel). Forexample, when TFD elements are used, a display area of a substrate 300at an observer side has a structure as shown in FIG. 13. That is,instead of the segment electrodes 314, a plurality of rectangular pixelelectrodes 334 is aligned in a matrix, and the individual pixelelectrodes 334 aligned in one line are connected to one data line 314bvia the individual TFD elements 320. Since the TFD element 320 is formedof a first metal film 322/an insulating film 324 formed by anodizing thefirst metal film 322/a second metal film 326 when viewed from thesubstrate 300, that is, since a sandwiched structure of a metal/aninsulating material/a metal is formed, the current-voltagecharacteristic thereof is nonlinear in both positive and negativedirections. In addition, in this case, the individual common electrodes214 formed on the substrate 200 at the back surface side are formed tooppose individual lines of the pixel electrodes 334 aligned in a matrix.In the structure described above, the second metal 326 can be formed ofthe same layer as that of the low-resistance conductive films 352, 362,and 372, and accordingly, the manufacturing process can be simplified.

[0113] In addition, in the First Embodiment, a transflective liquidcrystal display device is formed; however, without providing the openingportions 209, a reflective type may be merely formed. When a reflectivetype is formed, instead of a backlight, a front light emitting lightfrom the observer side may be provided when required.

[0114] Furthermore, in the embodiment, the conductance between thecommon electrodes 214 and the wirings 350 is formed by the conductiveparticles 114 mixed in the sealing material 110; however, a structuremay be formed in which the conduction is obtained in an area which isseparately provided outside the frame formed of the sealing material110.

[0115] Furthermore, since the common electrodes 214 and the segmentelectrodes 314 have a relative relationship with each other, a structuremay be formed in which common electrodes are formed on the substrate 300at the observer side, and segment electrodes are formed on the substrate200 at the back surface side. In the structure described above, thesegment electrodes formed on the substrate 200 at the back surface sideare connected to wirings 350 formed on the substrate 300 at the observerside via the conductive particles 114 contained in the sealing material110.

[0116] In the First Embodiment described above, since the structurehaving the driver ICs 122 and 124 are mounted on the substrate 300 atthe observer side, the wirings 350, 360, and 370 are also provided onthe substrate 300 at the observer side; however, the present inventionis not limited thereto, the present invention can be applied to the casein which driver ICs and wirings are provided at the back surface side.

[0117] Accordingly, next, Second Embodiment will be described in whichthe drivers ICs and wirings are provided on a substrate at the backsurface side.

[0118]FIG. 14 is a perspective view showing an entire structure of aliquid crystal panel of the Second Embodiment. As shown in this figure,a liquid crystal panel 100 of the Second Embodiment is exactlyequivalent to that in the First Embodiment (refer to FIG. 1) inappearance; however, an observer side and a back surface side arecompletely opposite to those in the First Embodiment. That is, in theliquid crystal panel 100 of the Second Embodiment, a substrate (firstsubstrate) 300 is located at the back surface side, and a substrate(second substrate) 200 is located at the observer side.

[0119] In particular, as shown in FIG. 15 which is a partially explodedview of this liquid crystal panel taken along the X direction and asshown in FIG. 16 which is a partially exploded view of this liquidcrystal panel taken along the Y direction, on an opposing surface of thesubstrate 200 at the observer side, which opposes the substrate 300 atthe back surface side, a plurality of common electrodes 214 is formedextending in the X (line) direction, and on an opposing surface of thesubstrate 300 at the back surface side, which opposes the substrate 200at the observer side, a plurality of segment electrodes 314 is formedextending in the Y (column) direction.

[0120] In addition, in the vicinities of two edges of the substrate 300at the back surface side, which protrude from the substrate 200 at theobserver side, a driver IC 122 for driving the common electrodes 214 anda driver IC chip 124 for driving the segment electrodes 314 are mountedby a COG technique in a manner similar to that in the First Embodiment,and in addition, between the vicinities of the two edges, to the outsideof the area on which the driver IC chip 124 is mounted, an FPC substrate150 is bonded.

[0121] In the Second Embodiment, the common electrodes 214 formed on thesubstrate 200 at the observer side are connected to ends of wirings 350formed on the substrate 300 at the back surface side via conductiveparticles 114 mixed in a sealing material 110. In addition, the otherends of the wirings 350 are connected to output side bumps of the driverIC 122. In this connection, from the FPC substrate 150 (bonded portion)to the input side bumps of the driver chip 122, wirings 360 extend whichare formed on the substrate 300.

[0122] In addition, the segment electrodes 314 formed on the substrate300 at the back surface side are directly connected to output side bumpsof the driver IC 124. Under segment electrodes 314 formed from theoutside of the frame of the sealing material 110 to positions just infront of the output side bumps of the driver IC 124, low-resistanceconductive films 312 of the segment electrodes 314 are formed so thatthe wirings 310 are formed (refer to FIG. 14 and FIG. 16). In thisconnection, from the FPC substrate 150 (bonded portion) to input sidebumps of the driver IC chip 124, wirings 370 are formed on the substrate300.

[0123] Next, the display area of the liquid crystal panel 100 of theSecond Embodiment will be described in detail. First, the substrate 200at the observer side will be described in detail.

[0124] As shown in FIGS. 15 and 16, to the exterior surface of thesubstrate 200, a retardation film 133 and a polarizer 131 are adhered.In addition, on the interior surface of the substrate 200, a pluralityof strip-formed common electrodes 214, composed of a transparentconductive material such as ITO, is formed extending in the X direction(the left to right direction in FIG. 15, and the direction perpendicularto the paper in FIG. 16).

[0125] Furthermore, on the surfaces of the common electrodes 214 and thesubstrate 200, an alignment film 208 composed of a polyimide or the likeis formed. In this connection, since the alignment film 208 is notnecessary outside the display area, this film is not provided in thevicinity of the sealing material 110 and in the outside thereof.

[0126] Subsequently, the substrate 300 at the back surface side will bedescribed. To the exterior surface of the substrate 300, a retardationfilm 123 and a polarizer 121 are adhered. In addition, on the interiorsurface of the substrate 300, a scattering resinous layer 303 havingirregularity thereon is formed. The scattering resinous layer 303 isequivalent to the scanning resinous layer 203 described in the FirstEmbodiment, and on the irregular surface, a reflecting film 304 isformed.

[0127] Accordingly, in conformity with the irregularity of thescattering resinous layer 303, the surface of the reflecting film 304has irregularity, and hence, when light incident from the observer sideis reflected at the reflecting film 304, the light is appropriatelyscattered.

[0128] In addition, the reflecting film 304 is formed by patterning areflecting metal film such as aluminum or silver to have a widthapproximately equivalent to that of the segment electrode 314 so as tooverlap therewith when viewed from above. Accordingly, segmentelectrodes 314 adjacent to each other are formed so that capacitivecoupling therebetween via the reflecting film 304 is unlikely to occur.

[0129] Furthermore, since a liquid crystal display device according tothis embodiment also serves as a transmissive type, two opening portions309 for allowing light from a backlight to pass therethrough are formedfor each sub-pixel in the reflecting film 304 when patterning isperformed therefor (refer to FIG. 17).

[0130] Subsequently, on the surfaces of the reflecting films 304,corresponding to the areas at which the common electrodes 214 and thesegment electrodes 314 cross with each other, red color filters 305R,green color filters 305G, and blue color filters 305B are provided in astripe alignment, and three sub-pixels of R (red), G (green), and B(blue) form one pixel in the form of an approximately regular tetragon.However, the present invention is not limited thereto as is the case ofthe First Embodiment.

[0131] In addition, at the boundaries of these color filters 305R, 305G,and 305B and at the outside periphery defining the display area, ashading film 302 is provided, which are formed by patterning a shadingmetal layer composed of chromium or the like, so as to prevent thecolors from being mixed among the sub-pixels and to serve as a frame fordefining the display area.

[0132] Next, on the surfaces of the color filters 305R, 305G, and 305B,and the surface of the shading film 302, a planarizing film 307 composedof an insulating material is formed, whereby steps of the color filters,the shading film, and the like are planarized. In addition, on the flatsurface of the planarizing film 307 thus obtained, a plurality ofstrip-shaped segment electrodes 314 composed of a transparent conductivematerial, such as ITO, is formed extending in the Y direction (thedirection perpendicular to the paper of FIG. 15, and the right to leftdirection in FIG. 16). Furthermore, on the surfaces of the segmentelectrodes 314 and the planarizing film 307, an alignment film 308composed of a polyimide or the like is formed. Since the alignment film308, the planarizing film 307 thereunder, and the like are not necessaryin an area other than the display area, they are not provided in thevicinity of the sealing material 110 and in the outside thereof.

[0133] As described above, in the liquid crystal panel 100 of the SecondEmbodiment, which differs from that of the First Embodiment, thesubstrate 200 is located at the observer side, and the substrate 300 islocated at the back surface side. Accordingly, in the liquid crystalpanel 100 of the Second Embodiment, when the vicinity of the area atwhich the sealing material 110 is formed is viewed from the observerside, as shown in FIG. 17, the top to bottom relationship of the commonelectrodes 214 and the segment electrode 314 is reversed compared tothat in the First Embodiment (refer to FIG. 3). In this connection, across-sectional view taken along the line A-A′ in FIG. 17 is inaccordance with the coordinate axes shown in parentheses in FIG. 4 sincethe observer side and the back surface side are opposite to each other(since the z direction is reversed).

[0134] In addition, when the observer side is at the upper side, thedirections of the mounting surfaces of the driver ICs 122 and 124 arereversed compared to the case in the First Embodiment (refer to FIG. 5).As a result, a plan view of the wiring structure in the mounting area ofthe driver IC 122 viewed from the observer side through the back surfaceside, that is, a plan view of the mounting area of the driver IC viewedfrom above, is in accordance with the coordinate axes shown inparentheses in FIG. 6, and this fact indicates that the observer sideand the back surface side are opposite to each other (the z direction isreversed).

[0135] Accordingly, the arrangement of the wirings 350, 360, and 370 inthe Second Embodiment is exactly equivalent to that in the FirstEmbodiment; however, since they are provided on the back surface side,when the observer side is the upper side, the top to bottom relationshipis reversed compared to that in the First Embodiment.

[0136] That is, as is the case of the First Embodiment, the wirings 350,360, and 370 are formed by laminating low-resistance conductive films352, 362, and 372 and transparent conductive films 354, 364, and 374composed of the same layer as that of the segment electrode 314,respectively. However, in the Second Embodiment, the low-resistanceconductive films 352, 362, and 372 are formed of the same layer as thatof the shading film 302. That is, in this embodiment, by patterning ashading metal layer composed of, for example, chromium, the shading film302 and the low-resistance conductive films 352, 362, and 372 areformed. Accordingly, next, a method for manufacturing the substrate willbe described mainly on the substrate 300 at the back surface side.

[0137] For ease of illustration, the inside of the sealing frame(display area), the sealing material, and the outside of the sealingframe will be described, respectively, mainly on the segment electrodes314 and the wirings 350.

[0138] First, as shown in FIG. 19(a), a negative photoresist is appliedon the entire interior surface of the substrate 300 and is then baked,thereby forming a resinous layer 303″. Next, the resinous layer 303″ isexposed by using a photomask allowing a number of light rays to locallypass therethrough and is then developed. As a result, as shown in thesame figure (b), in the inside of the sealing frame, areas (exposedareas) exposed by the light are removed, thereby forming a number ofprojections 303 a. In this connection, by using a positive photoresist,the projections 303 a may be formed by curing areas exposed by light andby removing areas which are not exposed by the light.

[0139] Next, as shown in the same figure (c), the substrate 300 havingthe projections 303 a formed thereon is processed by a heating treatmentat a temperature higher than a heat distortion temperature of thephotoresist. By this heating treatment, the projections 303 a aresoftened, whereby the corner portions thereof become round. As a result,a scattering resinous layer 303 is formed having relatively smoothirregularity. In this connection, in accordance with the scatteringcharacteristics required for the scattering resinous layer 303, amaterial (viscosity, film thickness, and the like) for the resinouslayer 303″, the shape of the projection 303 a, and intervalstherebetween are determined.

[0140] Furthermore, as shown in the same figure (d), a reflecting layer304′ composed of a silver alloy or aluminum is formed by sputtering orthe like. Next, as shown in the same figure (e), the reflecting layer304′ is patterned by a photolithographic technique and an etchingtechnique, thereby forming the reflecting films 304. When the patterningis performed, the opening portions 309 are simultaneously formed.

[0141] Subsequently, a resinous layer colored by one of R (red), G(green), and B (blue) is formed and is then patterned by aphotolithographic technique and an etching technique, thereby forming acolor filter displaying one color. The color filters for the other twocolors are formed by patterning in a manner similar to that describedabove. As a result, as shown in FIG. 20(f), on the reflecting films 304having the opening portions 309 therein, the color filters 305R, 305G,and 305B are formed corresponding to the individual colors, R, G, and B,respectively.

[0142] Next, as shown in the same figure (g), on the entire interiorsurface of the substrate 300, a metal (for example, chromium) having aresistance lower than that of a metal oxide having transparency, such asITO, is deposited by sputtering or the like, thereby forming alow-resistance metal layer 302′. Next, as shown in the same figure (h),the low-resistance metal layer 302′ is patterned by a photolithographictechnique and an etching technique, whereby the shading film 302 isformed in the display area which is inside the sealing frame, andoutside the sealing frame, in addition to the low-resistance conductivefilms 352 forming the wirings 350, the low-resistance conductive films312, 362, and 372 forming the wirings 310, 360, and 370, respectively,are formed.

[0143] Next, as shown in the same figure (i), a resinous material suchas an acrylic resin is applied or printed and is then baked, therebyforming the planarizing film (overcoat) 307. The planarizing film 307 isformed so as to cover the individual color filters 305R, 305G, and 305B,and the reflecting films 307 and is not formed on the area at which thesealing material 110 is to be formed.

[0144] Subsequently, as shown in FIG. 21(j), on the entire interiorsurface of the substrate 300 having the planarizing film 307 formedthereon, a transparent conductive layer 314′ composed of, for example,ITO is formed by sputtering or an ion plating method. Next, as shown inthe same figure (k), the transparent conductive layer 314′ is patternedby a photolithographic technique and an etching technique, in additionto the transparent conductive films 354 forming the wirings 350, thetransparent conductive films 364 and 374 forming the wirings 360 and370, respectively, are formed.

[0145] Subsequently, after coating or printing of, for example, apolyimide solution is performed, baking is performed, thereby formingthe alignment film 308 as shown in the same FIG. (1). After the stepdescribed above, a rubbing treatment is performed on the alignment film308.

[0146] Even though not shown in figures, manufacturing process for thesubstrate 200 at the observer side is briefly described below. That is,first, a transparent conductive layer composed of ITO or the like isformed on the entire interior surface of the substrate 200; secondary,the common electrodes 214 are formed by patterning this transparentconductive layer; and thirdly, the alignment film 208 is formed bybaking after coating or printing of a polyimide solution is performed,and a rubbing treatment is then performed on the alignment film 208.

[0147] Next, the substrate 300 at the back surface side having thealignment film 308 processed by a rubbing treatment and the substrate atthe observer side also having the alignment film 208 processed by arubbing treatment are bonded together with the sealing material 110having the conductive particles 114 appropriately dispersed therein, andafter the laminate thus formed is placed in a state approximately avacuum, the liquid crystal 160 is dripped in the opening portion of thesealing material 110. Next, by returning the pressure to normalpressure, the liquid crystal 160 is infiltrated inside the sealingframe, and the opening portion is then encapsulated by an encapsulatingmaterial 112. Subsequently, as described above, by mounting the driverICs 122 and 124, and the FPC substrate 150, the liquid crystal panel 100as shown in FIG. 14 is formed.

[0148] Display operation of the Second Embodiment is fundamentallyequivalent to that in the First Embodiment. That is, outside light fromthe observer side in a reflective type is placed in a predeterminedpolarized state when transmitted through the polarizer 131 and theretardation film 133, and the light then reaches the reflecting film 304via a path from the substrate 200 at the observer side→the commonelectrode 214→the liquid crystal 160→the segment electrode 314→theplanarizing film 307→the color filter 305. Subsequently, the light isreflected at the reflecting film 304 and retraces its way through whichit passed.

[0149] On the other hand, light emitted from a backlight (not shown) ina transmissive type is placed in a predetermined polarized state whentransmitted through the polarizer 121 and the retardation film 123, andthe light then emitted to the observer side via a path from thesubstrate 300 at the back surface side→the opening portions 309→thecolor filter 305→the planarizing film 307→the segment electrode 314→theliquid crystal 160→the common electrode 214→the substrate 200 at theobserver side→the polarizer 131.

[0150] Accordingly, in the Second Embodiment, as is the case of theFirst Embodiment, in both the reflective type and the transmissive type,the amount of the light finally viewed by the observer is controlled foreach sub-pixel.

[0151] According to the Second Embodiment described above, similar tothe case of the First Embodiment, when outside light is sufficient,reflective type can be used, and when outside light is not sufficient, atransmissive type can be mainly used by turning on the backlight,whereby both display can be performed.

[0152] In the Second Embodiment, since the wirings 350, 360, and 370,which are located outside the display area, are formed by laminating thetransparent conductive films 354, 364, and 374 and the low-resistanceconductive films 352, 362, and 372, which are the same layer as that ofthe shading metal layer 302, respectively, compared to a single layerformed of one of the two films, a lower resistance can be obtained. Inaddition, since the segment electrodes 314 are each laminated with thelow conductive film 312 outside the sealing frame, a lower resistancecan be obtained.

[0153] Furthermore, since these low-resistance conductive films 312,352, 362, and 372 are formed by patterning the same layer as that of theshading film 302 which prevents colors from being mixed and defines theframe, an additional manufacturing process is not required. As a result,in the Second Embodiment, the manufacturing process cannot becomplicated, and hence, the liquid crystal device can be easilymanufactured at inexpensive cost.

[0154] In addition, in the Second Embodiment, since the reflecting film309 is patterned so as to form a strip-shaped film approximatelyequivalent to the shape of the segment electrodes 314, capacitivecoupling therebetween via the reflecting film 304 is unlikely to occur.

[0155] In addition, in the Second Embodiment, among the segmentelectrodes 314 formed above the substrate 300 at the back surface side,segment electrodes from the outside of the frame of the sealing material110 to positions just in front of the output side bumps of the driver IC124 are provided with the low-resistance conductive films 312 thereunder(even though the distance is short) so that the wirings 310 having alaminated structure is formed, and accordingly, a lower resistance canbe obtained.

[0156] According to the Second Embodiment described above, applicationsequivalent to those described in Embodiment can be performed. Forexample, as shown in FIG. 22, a structure may be formed in which thecommon electrodes 214 and the segment electrodes 314 are respectivelydriven by a one-chip driver IC 126 formed by the combination of thedriver ICs 122 and 124.

[0157] In addition, without mounting a driver IC on the liquid crystalpanel 100, it may be mounted on the FPC substrate 150 using a flip chiptechnique or a TAB technique. In this connection, FIG. 23 is aperspective view showing an example of the one-chip driver IC 126mounted on the FPC substrate 150.

[0158] Furthermore, in the Second Embodiment, the transflective liquidcrystal device is described; however, a simple reflective type may alsobe formed without providing the opening portions 309. When thereflective type is formed, instead of a backlight, a front lightemitting light from the observer side may be provided when necessary.

[0159] In addition, in the embodiment, the conductance between thecommon electrodes 214 and the wirings 350 by the conductive particles114 mixed in the sealing material 110 is described; however, a structuremay be formed in which the conductance is obtained at a different placeadditionally formed outside the frame of the sealing material 110.

[0160] Since the common electrodes 214 and the segment electrodes 314have a relative relationship with each other, a structure may be formedin which the segment electrodes are formed on the substrate 200 at theobserver side, and the common electrodes are formed on the substrate 300at the back surface side. In the structure described above, the segmentelectrodes formed on the substrate 200 at the observer side areconnected to the wirings 350 formed on the substrate 300 at the backsurface side via the conductive particles 114 contained in the sealingmaterial 110.

[0161] Furthermore, in the Second Embodiment, as is the case in theFirst Embodiment, a structure may be formed in which each sub-pixel (orpixel) is driven by a TFD element provided therewith.

[0162] In Embodiments 1 and 2, a TN type is used as the liquid crystal;however, a bistable type having memory-type characteristics, such as aBTN (Bi-stable Twisted Nematic) type, or a ferroelectric type; a polymerdispersed type; and a GH (Guest-Host) type in which dye molecules andliquid crystal molecules are aligned in parallel by dissolving a dyehaving anisotropic absorption of the visible light in a long axisdirection and a short axis direction in liquid crystal havingpredetermined molecular alignment; may also be used.

[0163] In addition, vertical orientation (homeotropic orientation) maybe employed in which liquid crystal molecules are aligned in thevertical direction with respect to the two substrates when no voltage isapplied to the liquid crystal, and the liquid crystal molecules arealigned in the horizontal direction with respect to the two substrateswhen voltage is applied thereto, and parallel (horizontal) orientation(homogeneous orientation) may also be employed in which liquid crystalmolecules are aligned in the horizontal direction with respect to thetwo substrates when no voltage is applied to the liquid crystal, and theliquid crystal molecules are aligned in the vertical direction withrespect to the two substrates when a voltage is applied thereto. Asdescribed above, the present invention can be applied to various typesof liquid crystal and orientation methods.

[0164] Next, several examples of particular electronic apparatuses usingthe liquid crystal display devices described above will be described.

[0165] First, an example in which the liquid crystal display device ofthe embodiment is applied to a mobile personal computer will bedescribed. FIG. 24 is a perspective view showing the structure of thepersonal computer. In the figure, a personal computer 1100 is composedof a main body portion 1104 provided with a keyboard 1102 and a liquidcrystal unit 1106. The liquid crystal unit 1106 is formed by providing abacklight (not shown) on the back surface of the liquid crystal panel100 described above. Accordingly, when outside light is sufficient, theliquid crystal panel is used as a reflective type, and when outsidelight is not sufficient, it is used as a transmissive type by turning onthe backlight, whereby the display can be viewed.

[0166] Next, an example in which the liquid crystal display device isapplied to a mobile phone will be described. FIG. 25 is a perspectiveview showing the structure of the mobile phone. In the figure, a mobilephone 1200 comprises, in addition to a plurality of operation buttons1202, an earpiece 1204, a mouthpiece 1206, and the liquid crystal panel100 described above. On the back surface of the liquid crystal panel100, a backlight (not shown) for improving the visibility is providedwhen necessary.

[0167] Furthermore, a digital still camera using a liquid crystal devicefor a viewfinder thereof will be described. FIG. 26 is a perspectiveview showing the structure of this digital still camera, and inaddition, briefly showing connection with external apparatuses.

[0168] Compared to a typical camera exposing a film using an opticalimage of the object, a digital camera 1300 produces imaging signals byperforming photoelectric conversion of an optical image of the objectusing an imaging element such as a CCD (Charged Coupled Device). On theback surface of a case 1302 of the digital still camera 1300, the liquidcrystal panel 100 is provided, and the structure is formed so as toperform display in accordance with the imaging signals from the CCD.Accordingly, the liquid crystal panel 100 serves as a viewfinder fordisplaying the object. In addition, on the front side (the back surfaceside in the figure) of the case 1302, a light-receiving unit 1304containing an optical lens, a CCD, and the like is provided.

[0169] When a picture taker views an object image displayed on theliquid crystal panel 100 and then presses a button 1306, an imagingsignal of the CCD at that time is transferred and stored in a memory ofa circuit substrate 1308. In addition, in the digital still camera 1300,on the side surface of the case 1302, a video signal output terminal1312 and an input/output terminal 1314 for data communication areprovided. In addition, as shown in the figure, when it is necessary, atelevision monitor 1430 is connected to the former, i.e., the videosignal output terminal 1312, and a personal computer 1440 is connectedto the latter, i.e., the input/output terminal 1314 for datacommunication. Furthermore, in accordance with a predeterminedoperation, the imaging signal stored in the memory of the circuitsubstrate 1308 is output on the television monitor 1430 or to thepersonal computer 1440.

[0170] As an electronic apparatus, in addition to the personal computerin FIG. 24, the mobile phone in FIG. 25, and the digital still camera inFIG. 26, there may be mentioned a liquid crystal television, aviewfinder type and a direct viewing video tape recorder, a carnavigation apparatus, a pager, an electronic notebook, an electroniccalculator, a word processor, a workstation, a television phone, a POSterminal, an apparatus provided with a touch panel, or the like. Todisplay portions for the various electronic apparatuses described above,the display devices described above can be naturally applied.

[0171] As described above, according to the present invention, since theresistance of the wiring provided on the substrate is formed of thelaminated film of the transparent conductive film composed of the samelayer as that of the transparent electrode and the low-resistanceconductive layer of a material having a lower resistance than that ofthe transparent conductive film, compared to a single layer composed ofone of the two films, a lower wiring resistance can be obtained.

What is claimed is:
 1. A liquid crystal device having a first substrateand a second substrate, which are disposed to oppose each other, andliquid crystal enclosed in a gap between the first substrate and thesecond substrate, comprising: a plurality of first transparentelectrodes provided on the first substrate; a conductive shading filmwhich is provided between the first transparent electrodes adjacent toeach other and which is not in electrical contact with the firsttransparent electrodes; and a wiring which is provided on the firstsubstrate and which are connected to the first transparent electrodes;wherein the wiring comprises substantially the same layer as that of thefirst transparent electrodes and substantially the same layer as that ofthe shading film.
 2. A liquid crystal device having a first substrateand a second substrate, which are disposed to oppose each other, andliquid crystal enclosed in a gap between the first substrate and thesecond substrate, comprising: a plurality of first transparentelectrodes provided on the first substrate; a conductive shading filmwhich is provided between the first transparent electrodes adjacent toeach other and which is not in electrical contact with the firsttransparent electrodes; a wiring provided on the first substrate; asecond transparent electrode provided on the second substrate; and aconductive material connecting the wiring and the second transparentelectrode; wherein the wiring comprises substantially the same layer asthat of the first transparent electrodes and substantially the samelayer as that of the shading film.
 3. A method for manufacturing aliquid crystal device having a first substrate and a second substrate,which are disposed to oppose each other, and liquid crystal enclosed ina gap between the first substrate and the second substrate, comprising:a step of providing a plurality of first transparent electrodes on thefirst substrate; a step of providing a conductive shading film betweenthe first transparent electrodes adjacent to each other so as not to bein electrical contact with the first transparent electrodes; and a stepof providing wirings connected to the first transparent electrodes onthe first substrate; wherein the wirings are formed so as to comprisesubstantially the same layer as that of the first transparent electrodesand substantially the same layer as that of the shading film.
 4. Amethod for manufacturing a liquid crystal device having a firstsubstrate and a second substrate, which are disposed to oppose eachother, and liquid crystal enclosed in a gap between the first substrateand the second substrate, comprising: a step of providing a plurality offirst transparent electrodes on the first substrate; a step of providinga conductive shading film between the first transparent electrodesadjacent to each other so as not to be in electrical contact with thefirst transparent electrodes; and a step of connecting a wiring providedon the first substrate and a second transparent electrode provided onthe second substrate by a conductive material; wherein the wiring isformed so as to comprise substantially the same layer as that of thefirst transparent electrodes and substantially the same layer as that ofthe shading layer.